The three-day IEEE Electrical Design of Advanced Packaging & Systems Symposium was held in Lecture Theatre West, International Campus beginning December 14th. Nearly 200 experts and scholars from domestic and overseas joined the symposium, such as Prof. Andreas Cangellaris, the Dean of the College of Engineering at the University of Illinois at Urbana-Champaign, Vice Chancellor-elect for academic affairs and Provost-elect, Prof. Junfa Mao, Member of Chinese Academy of Sciences, Prof. Kaustav Banerjee, University of California, Santa Barbara, Prof. Jun Fan, Missouri University of Science and Technology, Prof. Tetsu Tanaka, Tohoku University and many others. Prof. Erping Li, Dean of Zhejiang University/University of Illinois at Urbana Champaign Institute (ZJUI) gave an opening speech, expressing a warm welcome to guests and good wishes for the symposium. Prof. Li briefly introduced the first-class facilities of International Campus, Zhejiang University and the rich faculty of ZJUI.
Dean Andreas Cangellaris gave a keynote presentation on “Stochastic Electromagnetic Field Modeling for EMI/EMC-Aware Design of Electronic Systems”, which was a very enlightening and interesting presentation. Prof. Kaustav Banerjee’s keynote presentation was on “2D Materials for Smart Life”, where he explained the status and prospect of two-dimensional materials. He made it a detailed, vivid, and creative presentation. Prof. Philip Krein, Executive Dean of ZJUI gave a keynote presentation on “Integrating Thermal, Electrical, and Materials Issues for Extreme-Density Power Electronics” in which he talked about the problems of power supply management when the density of power electronic systems increases. This topic is of great referential value. Prof. Tetsu Tanaka gave his keynote presentation on “3D-IC Technology: Reliability Challenges and Biomedical Application”, revealing the reliability problems and the application of this technique in biomedicine. Prof. Jun fan introduced the dense signal routing solution in high bandwidth memorizer in 3D packaging in his keynote presentation “Signal Integrity Designs of HBM in 3D Packaging”.
The tutorial sessions, oral sessions and poster session took place in other rooms of the theatre. Jose Dchutt-Aine, James L. Drewniak, Madhavan Swaminathon and other well-known scholars made wonderful reports, communicated with each other, and shared their own research findings with intense passion.
The 2017 EDAPS has 198 registered participators, including 52 people from overseas. The symposium received 187 papers, including 144 from China and 43 from overseas, accepted 169 papers, invited five international authoritative scholars to make the keynote presentation, and invited many international well-known scholars to join the workshops and other parallel sessions. This high level international symposium raised the influence of ZJUI, prompted the international academic exchange between Chinese academia and the international academia in electrical and electronic areas. And this symposium has definitely had a positive effect on the further development and technical cooperation of ZJUI electrical area.
